US Patent Issued to CANSEMI TECHNOLOGY on Oct. 7 for "Wafer cleaning method and method for manufacturing semiconductor device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,986, issued on Oct. 7, was assigned to CANSEMI TECHNOLOGY INC. (Guangdong, China).

"Wafer cleaning method and method for manufacturing semiconductor device" was invented by Ruijing Han (Guangdong, China) and Hui Zeng (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a wafer cleaning method and a method for manufacturing semiconductor device. The wafer cleaning method includes: protonating a cleaning solution with a protonator; cleaning a wafer surface with the protonated cleaning solution so that the cleaned wafer surface carries an amount of negative charge smaller than an amount of negative charge prese...