US Patent Issued to Canon on Sept. 9 for "Conveyance apparatus, substrate processing apparatus, conveyance method, and article manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,558, issued on Sept. 9, was assigned to Canon K.K. (Tokyo).

"Conveyance apparatus, substrate processing apparatus, conveyance method, and article manufacturing method" was invented by Takashi Hosaka (Tochigi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conveyance apparatus connected to a substrate processing apparatus configured to bring a pressing member and a material on a substrate into contact with each other to form a cured film of the material on the substrate, the conveyance apparatus includes an acquisition unit configured to acquire a state of a peripheral portion of an adhesion substrate including the pressing member and the su...