ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,548, issued on Sept. 23, was assigned to Canon K.K. (Tokyo).
"Liquid ejection head and liquid ejection apparatus" was invented by Takuya Iwano (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A technology capable of suppressing misalignment of the arrangement position of an ejection substrate even if a flow path member thermally expands is provided. A module equipped with a substrate that ejects a liquid and a flow path that is fluidly connected to the substrate is inserted and engaged with a frame that supports a support member for supporting the substrate so that the frame and the flow path face each other via a space in a direction intersec...