US Patent Issued to Canon on Oct. 28 for "Semiconductor device having an insulating portion with a top smaller in width than a diameter of a conductive particle, display device, image capturing device, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,692, issued on Oct. 28, was assigned to Canon K.K. (Tokyo).

"Semiconductor device having an insulating portion with a top smaller in width than a diameter of a conductive particle, display device, image capturing device, and electronic apparatus" was invented by Hidemasa Oshige (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a first substrate; a functional element arranged on a main surface of the first substrate; a terminal connected to an electrode electrically connected to the functional element and arranged on a second substrate different from the first substrate; an insulating portion configured ...