US Patent Issued to CANON on Nov. 4 for "Apparatus including a bonding head and a method of using the same" (Texas Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,081, issued on Nov. 4, was assigned to CANON K.K. (Tokyo).

"Apparatus including a bonding head and a method of using the same" was invented by Byung-Jin Choi (Austin, Texas), Anshuman Cherala (Austin, Texas), Mario Johannes Meissl (Austin, Texas) and Nilabh K. Roy (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus can include a bonding head. The bonding head can include a bonding head body, a die chuck body, and lands. The bonding head body can be coupled to the die chuck. The lands can define zones. The lands and zones can be configured so that an outer zone can be under vacuum to hold a die while an inner zone is pressurized...