ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,206, issued on Nov. 25, was assigned to CANON K.K. (Tokyo).
"Wafer, and liquid ejection chip" was invented by Ryotaro Murakami (Kanagawa, Japan), Manabu Otsuka (Kanagawa, Japan) and Masaya Uyama (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. To that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove."
The patent was filed on Nov. 29, 2023, under Applicat...