US Patent Issued to Canon on Nov. 18 for "Liquid ejection head, element substrate, and manufacturing methods thereof" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,742, issued on Nov. 18, was assigned to Canon K.K. (Tokyo).

"Liquid ejection head, element substrate, and manufacturing methods thereof" was invented by Souta Takeuchi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an element substrate of a liquid ejection head, the method includes forming a silicon-based film layer including carbon on one surface of a base substrate, laminating a silicon substrate on the film layer formed on the one surface of the base substrate and bonding the silicon substrate to the film layer, processing the silicon substrate bonded to the film layer using the film layer as a stop lay...