US Patent Issued to Canon on June 24 for "Substrate conveyance method, substrate conveyance apparatus, molding method, and article manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,584, issued on June 24, was assigned to Canon K.K. (Tokyo).

"Substrate conveyance method, substrate conveyance apparatus, molding method, and article manufacturing method" was invented by Osamu Yasunobe (Tochigi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for conveying a substrate from a first to a second apparatus is provided. Material is applied to the substrate when on the first apparatus. A substrate conveyance apparatus including first and second holding portions is used. As a first step, the substrate is transferred from a first apparatus placement surface to the substrate conveyance apparatus. The substrate is then conveyed...