US Patent Issued to Canon on June 17 for "Molding apparatus for molding composition on substrate using mold, molding method, and method for manufacturing article" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,562, issued on June 17, was assigned to Canon K.K. (Tokyo).

"Molding apparatus for molding composition on substrate using mold, molding method, and method for manufacturing article" was invented by Takanori Endo (Utsunomiya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding apparatus for molding a composition on a substrate using a mold includes a conveying unit configured to convey an object, a holding unit configured to hold the object conveyed by the conveying unit, a supply unit configured to supply gas to an object space surrounding the object held by the holding unit, and a control unit configured to control the supply unit so tha...