US Patent Issued to Canon on June 10 for "Substrate for liquid ejection head and method for manufacturing substrate for liquid ejection head" (Japanese Inventor)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,236, issued on June 10, was assigned to Canon K.K. (Tokyo).

"Substrate for liquid ejection head and method for manufacturing substrate for liquid ejection head" was invented by Masataka Kato (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate for use in a liquid ejection head has an ejection hole for ejecting a liquid from the inside to the outside of the substrate. A plurality of scallops periodically changing the diameter of an inner circumferential surface of the ejection hole in the penetration direction are formed on the inner circumferential surface. The substrate for a liquid ejection head is characterized in that a wi...