US Patent Issued to Canon on July 1 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,495, issued on July 1, was assigned to Canon K.K. (Tokyo).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Junya Tamaki (Tokyo), Takafumi Miki (Kanagawa, Japan), Ryo Yoshida (Tokyo), Atsushi Kanome (Kanagawa, Japan), Kosuke Asano (Kanagawa, Japan), Takehiro Toyoda (Tokyo) and Masaki Kurihara (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a plurality of wirings each having a damascene structure on a semiconductor layer, wherein the plurality of wirings includes a first wiring and a second wiring adjacent to each other, wherein the first wiring includes, along a d...