ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,979, issued on July 1, was assigned to Canon K.K. (Tokyo).
"Device and method of manufacturing the device" was invented by Noriyuki Nakai (Tokyo) and Takamitsu Hoshihira (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a first member, a second member, and a bonding layer. A first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer. The bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive. A distance between the first surface and the second surface is smaller ...