US Patent Issued to Canon on Dec. 30 for "Method of bonding chips and a system for performing the method" (Texas Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,341, issued on Dec. 30, was assigned to Canon K.K. (Tokyo).

"Method of bonding chips and a system for performing the method" was invented by Byung-Jin Choi (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for bonding chips includes receiving chip placement information including positions on one or more product substrates where chips are to be bonded, generating instructions for a chip placement device to place a plurality of chips from one or more chip sources onto one or more intermediate substrates based on the received chip placement information, receiving the one or more intermediate substrates having the plurality of chips...