US Patent Issued to Canon on Aug. 26 for "Wafer chuck, method for producing the same, and exposure apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,906, issued on Aug. 26, was assigned to Canon K.K. (Tokyo).

"Wafer chuck, method for producing the same, and exposure apparatus" was invented by Keiji Hirabayashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer chuck includes a base made of a ceramic containing silicon carbide. The base has an oxidation-treated layer, and a film made of diamond-like carbon (DLC) is formed on an outermost surface of the base."

The patent was filed on Nov. 7, 2023, under Application No. 18/504,007.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fneta...