ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,162, issued on Nov. 18, was assigned to CAMTEK Ltd. (Migdal-Haemek, Israel).
"Bump measurement height metrology" was invented by Eyal Segev (Atlit, Israel).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for measuring height differences between tops of multiple bumps of an upper surface of a layer, the method may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors; and determining the height differences between the bumps and the correspon...