US Patent Issued to Cadence Design Systems on Nov. 11 for "Method and system to implement altitude based I/O re-layering for electronic and photonic designs" (Indian, French Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,875, issued on Nov. 11, was assigned to Cadence Design Systems Inc. (San Jose, Calif.).

"Method and system to implement altitude based I/O re-layering for electronic and photonic designs" was invented by Amit Kumar (Greater Noida, India), Hitesh Marwah (Noida, India) and Arnold Ginetti (Antibes, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is an improved approach to implement electronic designs by performing altitude-based re-layering for I/Os. The altitude-based die stack layers allows N number of die stack layers corresponding to the actual altitudes of the I/Os in the design."

The patent was filed on May 6, 2022, under Applica...