ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,760, issued on Aug. 19, was assigned to Cadence Design Systems Inc. (San Jose, Calif.).
"Wire density-aware layer assignment" was invented by Derong Liu (Austin, Texas), Wing-Kai Chow (Austin, Texas), Gracieli Posser (Austin, Texas), Mehmet Can Yildiz (Austin, Texas) and Charles Jay Alpert (Cedar Park, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure address systems and methods for density-aware layer assignment for integrated circuit (IC) designs. Data describing an IC design is accessed. The IC design comprises a net and a set of routing layers. Single-layer routing and an initial layer assignment is performed...