ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,383,924, issued on Aug. 12, was assigned to C3 Corp. (Appleton, Wis.).
"Hotmelt application system and process" was invented by Joseph F. Van De Hey (Kaukauna, Wis.), Alex M. Zirbel (Kaukauna, Wis.), Alex N. Kuffel (Appleton, Wis.), Jeffery J. VanHandel (Freedom, Wis.), Grant D. Daniels (Appleton, Wis.) and Scott S. Ebben (Appleton, Wis.).
According to the abstract* released by the U.S. Patent & Trademark Office: "System and process that continuously circulates hotmelt adhesive at a circulating pressure rate to apply hotmelt adhesive to a moving substrate on a substrate delivery conveyor. The system includes an adhesive delivery line connected to an elongated manifold, the manifold i...