US Patent Issued to C. Uyemura & Co. on Jan. 20 for "Pretreatment method for electroless plating, and pretreatment solution for electroless plating" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,145, issued on Jan. 20, was assigned to C. Uyemura & Co. Ltd. (Osaka, Japan).

"Pretreatment method for electroless plating, and pretreatment solution for electroless plating" was invented by Tetsuji Ishida (Osaka, Japan), Hisamitsu Yamamoto (Osaka, Japan) and Ryoyu Shimizu (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The purpose of the present invention is to provide a pretreatment method for electroless plating and a pretreatment solution for electroless plating capable of increasing an adsorption amount of a catalyst. A pretreatment method for electroless plating for performing an electroless plating on a substrate, the pretreatmen...