US Patent Issued to BYSTRONIC LASER on April 29 for "Method, control unit and laser cutting system for combined path and laser process planning for highly dynamic real-time systems" (Swiss Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,820, issued on April 29, was assigned to BYSTRONIC LASER AG (Niederonz, Switzerland).

"Method, control unit and laser cutting system for combined path and laser process planning for highly dynamic real-time systems" was invented by Markus Steinlin (Zurich, Switzerland) and Titus Haas (Zofingen, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A control unit for calculating a spatially and time-resolved, combined setpoint data set for control of a laser cutting process includes a measurement data interface for accessing sensor data during the cutting operation, a process interface to a first memory that stores a process model that estimates ...