US Patent Issued to BYD on Aug. 5 for "Electronic device housing, manufacturing method thereof, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,600, issued on Aug. 5, was assigned to BYD Co. Ltd. (Shenzhen, China).

"Electronic device housing, manufacturing method thereof, and electronic device" was invented by Lan Ma (Shenzhen, China), Haiyan Jin (Shenzhen, China) and Liang Chen (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interfac...