US Patent Issued to BYD on April 22 for "Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate" (Chinese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,766, issued on April 22, was assigned to BYD Co. Ltd. (Shenzhen, China).

"Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate" was invented by Wei Zhou (Shenzhen, China), Qiang Xu (Shenzhen, China) and Caicai Xie (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide l...