US Patent Issued to Buhler, Advanced Energy Industries on Aug. 26 for "RF sputtering of multiple electrodes with optimized plasma coupling through the implementation of capacitive and inductive components" (Colorado Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,830, issued on Aug. 26, was assigned to Buhler AG (Uzwil, Switzerland) and Advanced Energy Industries Inc (Fort Collins, Colo.).

"RF sputtering of multiple electrodes with optimized plasma coupling through the implementation of capacitive and inductive components" was invented by Ken Nauman (Fort Collins, Colo.), Masahiro Watanabe (Windsor, Colo.), Sarah Williams (Fort Collins, Colo.), Michael S. Thornton (Loveland, Colo.) and Michael Meyer (Windsor, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus comprises a vacuum chamber configured to produce a substantially atmospheric vacuum environment for plasma processing; a radio frequency...