US Patent Issued to Brooks Automation (Germany) on April 29 for "Core module for semiconductor production facility machinery" (Swiss, German Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,697, issued on April 29, was assigned to Brooks Automation (Germany) GMBH (Germany).

"Core module for semiconductor production facility machinery" was invented by Lutz Rebstock (Gaienhofen, Germany) and Yves Fenner (Berg, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to an apparatus (200, 200A, 300, 400) for a semiconductor production facility handling an object, the apparatus comprising a core module (100) and at least one functionality module (M.. ). A core module (100) as well as an operating method for such an apparatus are further aspects of the invention."

The patent was filed on Dec. 15, 2020, under Applicat...