US Patent Issued to BroadPak on March 18 for "Secure semiconductor integration and method for making thereof" (California Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,189, issued on March 18, was assigned to BroadPak Corp. (San Jose, Calif.).

"Secure semiconductor integration and method for making thereof" was invented by Farhang Yazdani (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package comprising a heat spreader; one or more substrate(s); one or more standoff(s); and one or more electronic component(s). One or more component(s) is/are coupled to a substrate and the substrate maybe coupled to a heat spreader. Standoff(s) are coupled on the heat spreader or substrates forming a cavity, and one or more component(s) and substrate(s) are located inside the cavity."

Th...