ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,783, issued on June 10, was assigned to BroadPak Corp. (San Jose, Calif.).
"3D system integration" was invented by Farhang Yazdani (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serializer/deserializer blocks, using the TVs."
The patent was filed on Dec. 27, 2023, under Applic...