ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,993, issued on Oct. 7, was assigned to Brewer Science Inc. (Rolla, Mo.).
"Adhesion layers for EUV lithography" was invented by Andrea M. Chacko (Rolla, Mo.), Vandana Krishnamurthy (Rolla, Mo.), Yichen Liang (Round Rock, Texas), Hao Lee (Camas, Wash.), Stephen Grannemann (Rolla, Mo.) and Douglas J. Guerrero (Tombeek, Belgium).
According to the abstract* released by the U.S. Patent & Trademark Office: "New lithographic compositions for use as EUV adhesion layers are provided. The present invention provides methods of fabricating microelectronics structures using those compositions as well as structures formed by those methods. The method involves utilizing an adhesion layer immediat...