US Patent Issued to Brewer Science on Aug. 5 for "Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding" (American, Taiwanese, Belgian Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,170, issued on Aug. 5, was assigned to Brewer Science Inc. (Rolla, Mo.).

"Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding" was invented by Chia-Hsin Lee (Taoyuan, Taiwan), Alice Guerrero (Overijse, Belgium), Arthur O. Southard (St. James, Mo.), Chen-Yu Wu (Taipei, Taiwan) and Xiao Liu (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Achieving homogeneous and heterogeneous integration for 2.5D and 3D integrated circuit, chip-to-wafer, chip-to-substrate, or wafer-to-wafer bonding is an essential technology. The landing wafer or substrate is bonded with a carrier by using a t...