ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,105, issued on July 15, was assigned to BOSTIK SA (Colombes, France).
"Low tack hot-melt pressure sensitive adhesives" was invented by Xin Ye (Shanghai), Peipei He (Guangdong, China) and Danfeng Li (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a hot-melt pressure sensitive adhesive composition comprising at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil and from 4 to 15% by weight of at least one wax selected from the group consisting of paraffin waxes, Fischer-Tropsch waxes, ethylene-vinyl acetate waxes and any mixture thereof, based on the total weight of the hot-melt...