US Patent Issued to BONDTECH on March 25 for "Component mounting system and component mounting method" (Japanese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,070, issued on March 25, was assigned to BONDTECH Co. LTD. (Kyoto, Japan).

"Component mounting system and component mounting method" was invented by Akira Yamauchi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices. The chip mounting system calculates a relative positional deviation amount between the substrat...