ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,036, issued on June 24, was assigned to BONDTECH Co. LTD. (Kyoto, Japan).
"Resin shaping device" was invented by Akira Yamauchi (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for forma...