US Patent Issued to BOE TECHNOLOGY GROUP on Oct. 7 for "Apparatus for transferring light-emitting diode chip" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,030, issued on Oct. 7, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Apparatus for transferring light-emitting diode chip" was invented by Guangcai Yuan (Beijing), Haixu Li (Beijing), Xin Gu (Beijing) and Jing Feng (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides an apparatus for transferring LED chips, including: first light source configured to generate and emit first light rays; first support structure configured to carry load substrate, load substrate including light-transmissive substrate and the LED chips fixed on side of the light-transmissive substrate away from first light source by dissociation adh...