US Patent Issued to BOE TECHNOLOGY GROUP on May 20 for "Connecting substrate, fabrication method, splicing screen and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,208, issued on May 20, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Connecting substrate, fabrication method, splicing screen and display apparatus" was invented by Shuang Liang (Beijing), Muxin Di (Beijing), Zhiwei Liang (Beijing), Ke Wang (Beijing), Zhanfeng Cao (Beijing) and Yingwei Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a connecting substrate and a fabrication method, a splicing screen, and a display apparatus. The connecting substrate has panel areas (10) and connecting areas (30) connecting every two adjacent panel areas (10), each panel area including a display area (20) surrounded by the connec...