US Patent Issued to BOE TECHNOLOGY GROUP on March 11 for "Transfer structure and manufacturing method thereof, transfer device and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,524, issued on March 11, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Transfer structure and manufacturing method thereof, transfer device and manufacturing method thereof" was invented by Yang Yue (Beijing), Tong Yang (Beijing), Shi Shu (Beijing), Yong Yu (Beijing), Haitao Huang (Beijing), Xiang Li (Beijing), Qi Yao (Beijing), Xue Jiang (Beijing) and Guangcai Yuan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided in the embodiments are a transfer structure and a method thereof, and a transfer device and a manufacturing method thereof. The transfer structure includes: a first electrode, a piezoelectric layer, a second el...