US Patent Issued to BOE TECHNOLOGY GROUP on June 3 for "Substrate integrated with passive device and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,169, issued on June 3, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Substrate integrated with passive device and method for manufacturing the same" was invented by Yingwei Liu (Beijing), Zhanfeng Cao (Beijing) and Ke Wang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a substrate integrated with a passive device and a method for manufacturing the same. The method includes: providing and processing a transparent dielectric layer to obtain the transparent dielectric layer provided with a first connection via therein, with the transparent dielectric layer including a first surface and a second surfac...