US Patent Issued to BOE Technology Group on June 10 for "Display substrate with multiple via holes, electronic device, and method of manufacturing the display substrate" (Chinese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,993, issued on June 10, was assigned to BOE Technology Group Co. Ltd. (Beijing).

"Display substrate with multiple via holes, electronic device, and method of manufacturing the display substrate" was invented by Pan Xu (Beijing) and Zhidong Yuan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A display substrate, a method of manufacturing a display substrate, and an electronic device are provided. The display substrate includes: a base substrate; a thin film transistor arranged on the base substrate; a first planarization layer arranged on a side of the thin film transistor away from the base substrate; a first protective layer arranged on a ...