US Patent Issued to BOE TECHNOLOGY GROUP on Jan. 13 for "Substrate integrated with passive device and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,091, issued on Jan. 13, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Substrate integrated with passive device and method for manufacturing the same" was invented by Xiyuan Wang (Beijing) and Feng Qu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a substrate integrated with a passive device and a method for manufacturing the same, and belongs to the technical field of communications. The substrate integrated with a passive device according to the present disclosure includes a dielectric layer provided with a first connection via; and the passive device at least including an inductor. The inductor ...