US Patent Issued to BOE TECHNOLOGY GROUP on Feb. 4 for "Fingerprint identification substrate, electronic apparatus and fingerprint identification method" (Chinese Inventor)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,529, issued on Feb. 4, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Fingerprint identification substrate, electronic apparatus and fingerprint identification method" was invented by Hao Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a fingerprint identification substrate, an electronic apparatus and a fingerprint identification method. The fingerprint identification substrate includes a base substrate, a driving circuitry layer arranged on the base substrate, a shielding layer arranged at a side of the driving circuitry layer away from the base substrate and a detection electrode arranged at a...