US Patent Issued to BOE Technology Group on Aug. 5 for "Encapsulation structure, encapsulation method, electroluminescent device, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,379,528, issued on Aug. 5, was assigned to BOE Technology Group Co. Ltd. (Beijing).

"Encapsulation structure, encapsulation method, electroluminescent device, and display device" was invented by Qingyu Huang (Beijing), Wenqi Liu (Beijing), Fudong Chen (Beijing) and Zhiqiang Jiao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an encapsulation structure which is applicable for encapsulating an electroluminescent device, and includes: a first inorganic dielectric layer provided with a surface for being attached to a surface of a cathode layer of the electroluminescent device; wherein a dispersion relation among the first inorganic diele...