US Patent Issued to BOE TECHNOLOGY GROUP on April 15 for "Semiconductor apparatus having expansion wires for electrically connecting chips" (Chinese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,243, issued on April 15, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Semiconductor apparatus having expansion wires for electrically connecting chips" was invented by Chenyang Zhang (Beijing), Fuqiang Li (Beijing), Xue Dong (Beijing), Meili Wang (Beijing), Xuan Liang (Beijing), Fei Wang (Beijing), Mingxing Wang (Beijing), Zhanfeng Cao (Beijing), Yanling Han (Beijing) and Xinxin Zhao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base subst...