US Patent Issued to BOE MLED Technology, BOE Technology Group on March 25 for "Light-emitting chip and light-emitting substrate" (Chinese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,259, issued on March 25, was assigned to BOE MLED Technology Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing).

"Light-emitting chip and light-emitting substrate" was invented by Linxia Qi (Beijing), Junjie Ma (Beijing), Yuanda Lu (Beijing), Shanwei Yang (Beijing), Jiawei Zhao (Beijing), Zhijun Xiong (Beijing), Haiwei Sun (Beijing), Lingyun Shi (Beijing) and Jinpeng Li (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each s...