US Patent Issued to BOE MLED TECHNOLOGY, BOE TECHNOLOGY GROUP on Jan. 27 for "Light-emitting substrate, backlight module, display apparatus, and method for manufacturing light-emitting substrate" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,705, issued on Jan. 27, was assigned to BOE MLED TECHNOLOGY Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Light-emitting substrate, backlight module, display apparatus, and method for manufacturing light-emitting substrate" was invented by Jiaxin Li (Beijing), Donglei Li (Beijing), Honghao Yu (Beijing), Kun Lu (Beijing), Jiwei Sun (Beijing), Taotao Duan (Beijing) and Zhitao Zhang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting substrate includes a substrate, and a plurality of light-emitting devices, a plurality of driver chips and a plurality of supporting structures that are all disposed on a side of the...