US Patent Issued to BOE MLED Technology, BOE Technology Group on Aug. 12 for "Light-emitting diode chip, display substrate and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,733, issued on Aug. 12, was assigned to BOE MLED Technology Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing).

"Light-emitting diode chip, display substrate and manufacturing method thereof" was invented by Junjie Ma (Beijing), Haiwei Sun (Beijing), Yuanda Lu (Beijing), Shanwei Yang (Beijing), Linxia Qi (Beijing), Zhijun Xiong (Beijing) and Jiawei Zhao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conduc...