US Patent Issued to BOE MLED TECHNOLOGY, BOE TECHNOLOGY GROUP on April 22 for "Miniature light emitting diode chip, display substrate and method for manufacturing the display substrate, display device" (Chinese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,855, issued on April 22, was assigned to BOE MLED TECHNOLOGY Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Miniature light emitting diode chip, display substrate and method for manufacturing the display substrate, display device" was invented by Xaiwei Yun (Beijing), Chenchang Chen (Beijing), Wenchieh Huang (Beijing), Bo Gao (Beijing), Xuehai Qian (Beijing), Meiling Jin (Beijing), Wenjia Sun (Beijing) and Xiaozhou Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A miniature light emitting diode chip, a display substrate and a manufacturing method thereof, and a display device are provided. The miniature light emitting di...