US Patent Issued to BOARDTEK ELECTRONICS on Dec. 2 for "Power module for high-frequency use and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,076, issued on Dec. 2, was assigned to BOARDTEK ELECTRONICS Corp. (Taoyuan, Taiwan).

"Power module for high-frequency use and method for manufacturing the same" was invented by Chien-Cheng Lee (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency power module less vulnerable to parasitic phenomena includes first base board, power chip, and second base board. The first base board includes a first substrate, a first conductive wiring layer, and a second conductive wiring layer on each side of the first substrate. The power chip is disposed on the first conductive wiring layer. The second base board includes a second substr...