US Patent Issued to BIZLINK INTERNATIONAL on Feb. 17 for "Connector including substrate having through holes" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,959, issued on Feb. 17, was assigned to BIZLINK INTERNATIONAL CORP. (New Taipei, Taiwan).

"Connector including substrate having through holes" was invented by Chin-An Hsieh (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connector includes a first grounding terminal, a first signal terminal, a second signal terminal, a second grounding terminal, and a substrate. The first grounding terminal, the first signal terminal, the second signal terminal, and the second grounding terminal are arranged in sequence, and each of them has a contact area. The first grounding terminal, the first signal terminal, the second signal terminal, and ...