US Patent Issued to Bitmain Technologies on March 25 for "Chip heat dissipating structure, chip structure, circuit board and supercomputing device" (Chinese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,108, issued on March 25, was assigned to Bitmain Technologies Inc. (Beijing).

"Chip heat dissipating structure, chip structure, circuit board and supercomputing device" was invented by Lei Zhang (Beijing), Tao Zhou (Beijing), Tong Zou (Beijing) and Micree Zhan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal ...