US Patent Issued to BIONEER on Nov. 25 for "Conductive paste composition containing silver-coated copper nanowires with core-shell structure and conductive film comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,971, issued on Nov. 25, was assigned to BIONEER Corp. (Daejeon, South Korea).

"Conductive paste composition containing silver-coated copper nanowires with core-shell structure and conductive film comprising the same" was invented by Han Oh Park (Sejong-si, South Korea), Jae Ha Kim (Daejeon, South Korea), Jun Pyo Kim (Sejong-si, South Korea) and Kug Jin Yun (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive paste composition according to the present disclosure contains silver-coated copper nanowires with a core-shell structure; a binder mixture containing a silicone resin binder and a hydrocarbon-based resin binder; and...