US Patent Issued to Bio-Rad Laboratories on May 27 for "Electronic component assembly with thermally conductive structures for image sensors" (California, Arizona Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,316,935, issued on May 27, was assigned to Bio-Rad Laboratories Inc. (Hercules, Calif.).

"Electronic component assembly with thermally conductive structures for image sensors" was invented by Stephen Swihart (Walnut Creek, Calif.), Li Lu (Livermore, Calif.), Wade Jameson (Mesa, Ariz.), Evan Thrush (San Anselmo, Calif.), Michael Griffin (El Cerrito, Calif.) and Evelio Perez (Hercules, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board havi...