US Patent Issued to Besi Netherlands on Sept. 23 for "Method and mould for encapsulating electronic components mounted on a carrier" (Dutch Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,465, issued on Sept. 23, was assigned to Besi Netherlands B.V. (Duiven, Netherlands).

"Method and mould for encapsulating electronic components mounted on a carrier" was invented by Wilhelmus Gerardus Joseph Gal (Braamt, Netherlands), Johannes Lambertus Gerardus Maria Venrooij (Duiven, Netherlands) and Jan Roelofsen (Zevenaar, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein t...